| About this Abstract |
| Meeting |
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Symposium
|
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Presentation Title |
The Effect of Interface Cohesion on Layer Stability during Accumulative Roll Bonding of Cu/Ta Multilayers |
| Author(s) |
Liya V. Semenchenko, Umair B. Asim, Ryan M. Mier, Nancy Senabulya, Michael J. Demkowicz |
| On-Site Speaker (Planned) |
Liya V. Semenchenko |
| Abstract Scope |
We present a combined experimental and modeling investigation of composite morphology in Cu/Ta laminates processed by accumulative roll bonding. Using x-ray computed tomography, we examine numerous instances where Ta layers necked and pinched off during rolling. Maintaining layer continuity is important in the mechanical performance of multilayered metals. To understand the origin of layer instabilities, we carried out finite element simulations using an isotropic elastoplastic material model to model Cu and Ta layers in a representative volume element with different interaction properties between them. We demonstrate the plastic flow stability during rolling depends on interface cohesion and indicates that laminates with more uniform layer thickness may be processed by controlling the interface properties. |
| Proceedings Inclusion? |
Definite: At-meeting proceedings |