About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Nano and Micro Additive Manufacturing
|
Presentation Title |
Process Development and Microstructure Evaluation of Additive Manufacturing of Silicon Components |
Author(s) |
Austin Tiley, Chia-Yu Chang, Emily Holt, Yi Song, John Chen, Ben DiMarco, John Middendorf, Alan Luo |
On-Site Speaker (Planned) |
Austin Tiley |
Abstract Scope |
Additive manufacturing (AM) is being evaluated to produce near-net shape Silicon (Si) components for semiconductor applications. Silicon is a brittle material with a high ductile-to-brittle transition temperature (DBTT) resulting in poor machinability. Traditional AM systems, such as laser powder bed fusion (LPBF), are utilized to produce near-net shape parts. However, LPBF systems have a rapid cooling rate that can lead to microcracking for materials with a high DBTT. In this presentation, a LPBF dual laser setup with a traditional gaussian laser profile and an nLight multi-modal ring laser profile in tandem with a modified build plate preheat up to 500◦C. The microstructure and cracking response of AM Si parts was evaluated for each laser individually and with a “leader-follower” setup. This research provides critical understanding of cracking response related to LPBF process parameters, promising micro and macro additive manufacturing of near-net shape Si components. |
Proceedings Inclusion? |
Planned: |
Keywords |
Additive Manufacturing, Solidification, Electronic Materials |