| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XI
|
| Presentation Title |
Phase Diagram of Ternary Zn-Sb-Cu System and Thermoelectric Properties of Copper Doped Zn4Sb3 |
| Author(s) |
I-Lun Jen, You-Kai Su, Hsin-Jay Wu |
| On-Site Speaker (Planned) |
I-Lun Jen |
| Abstract Scope |
Thermoelectric (TE) materials have attracted growing attention in recent years. β-Zn4Sb3 is a promising mid-temperature TE material because it comprises cost-effective and earth-abundant elements. Nevertheless, the disordering Zn-interstitial in the Sb-framework induces the structural instability, limiting the utilization of Zn4Sb3-based alloys in TE generators. In this study, the thermodynamic approach coupled with Bridgman growth were aided in boosting the TE performance while settling the instability issue. The 623 K isothermal section Zn-Sb-Cu system is constructed in this work. In addition, Phase Diagram Engineering is an effective strategy to determine the solubility range of Cu content. At 623 K, the maximum solubility in Zn4Sb3 is less than 4 at.%Cu. Consequently, the Cu-doped Zn4-xSb3 alloys are prepared, and the Cu-substituted alloy achieves a figure of merit zT of 0.9 at 623 K, resulting from the enhanced power factor S2ρ-1 ~1.2 (mW/mk2). |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Other, Other |