About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
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Symposium
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Solid-State Diffusion Bonding of Metals and Alloys
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Presentation Title |
Phase-Field Modeling of Diffusion Bonding for Nuclear Engineering Applications |
Author(s) |
Rui Wang, Peng Wang, Sagar Bhatt, Mark Christian Messner, Todd Randall Allen, Fei Gao |
On-Site Speaker (Planned) |
Rui Wang |
Abstract Scope |
The high strength and reliability of diffusion bonding make it a preferred method for constructing compact heat exchangers in nuclear systems. Accurate and efficient modeling of the diffusion bonding process necessitates a comprehensive understanding of microstructure evolution under varying temperature and pressure conditions. In this work, we developed a phase-field model to simulate diffusion bonding within a multi-phase, multi-component framework. The model accounts for grain growth influenced by compressive loads and temperature history profiles, along with the formation of new phases due to dynamic recrystallization, precipitation, and oxidation. Using examples of 316H stainless steel and Alloy 617, our simulation results consistently align with experimental findings regarding grain size, distribution, and bonding quality under various conditions. This model elucidates the diffusion bonding mechanism and provides valuable insights for constructing reliable compact heat exchangers. |
Proceedings Inclusion? |
Planned: |
Keywords |
Iron and Steel, Modeling and Simulation, Phase Transformations |