| About this Abstract |
| Meeting |
MS&T23: Materials Science & Technology
|
| Symposium
|
Additive Manufacturing of Metals: Microstructure, Properties and Alloy Development
|
| Presentation Title |
Toward High Strength and High Conductivity Copper Alloys via Additive Manufacturing |
| Author(s) |
Keita Nomoto, Kangwei Chen, Simon P. Ringer |
| On-Site Speaker (Planned) |
Keita Nomoto |
| Abstract Scope |
Copper and its alloy are materials used in various applications due to their outstanding electrical and thermal conductivity. Copper is generally soft; thus, additional strength is required while maintaining high conductivity. Additive manufacturing offers a significant opportunity to build strong and high-conductive complex shape components, accessing a vast spatiotemporal thermal and stress parameter space. Successful copper alloys have been made in additive manufacturing; however, there remains uncertainty about powder characteristics and the correlation with the microstructure, mechanical properties, and conductivity of the additively manufactured copper alloys. In this study, we extensively characterise copper alloy powders using various microscopy and microanalysis techniques to understand which powder characteristics lead to an interesting build part property. Furthermore, we demonstrate how the characteristics of metal powder and printed part correlate with the build properties. The results shed light on a pathway toward fabricating stronger and highly conductive copper alloys in additive manufacturing. |