| About this Abstract |
| Meeting |
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
| Symposium
|
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
| Presentation Title |
Optimization of Electromagnetic Induction Heating for Adhesive Bonding – A Computational Study on Induction Bonding Process |
| Author(s) |
Taha Najam, Suhail Hyder Vattathurvalappil |
| On-Site Speaker (Planned) |
Taha Najam |
| Abstract Scope |
Thermoplastic polymers containing conductive particles have the ability to absorb electromagnetic radiation and transform it into thermal energy, resulting in the melting of the surrounding polymers. This composite mixture can function as a reversible adhesive for structural bonding using the electromagnetic radiation heating technique. It allows for quick, reversible, and precise heating of the bondline to aid in structural bonding. However, the thermomechanical deterioration of the bondline caused by the difficulties in precisely controlling the induction heating process is seen as a major obstacle to the widespread use of this technique. A multiphysics model was used in this study to find the best settings for induction heating, such as frequency, power, and the distance between the induction coil and the adhesive. The adhesive for the computational model is made of a composite material made of acrylonitrile butadiene styrene polymer and ferromagnetic conductive nanoparticles. The process parameter was optimized to provide optimal bonding time and limit any potential thermomechanical degradation in the adhesive bondline. In summary, the multiphysics process modeling simulation developed in this study can serve as a rule of thumb for designers to enhance the adhesive bonding process by utilizing electromagnetic induction heating. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |