About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
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Presentation Title |
Electric Current Effects on Stability and Mechanical Properties of Monoclinic Cu6Sn5 Phase Based on In-situ Nanoindentation |
Author(s) |
Shubhayan Mukherjee, Shih-kang Lin |
On-Site Speaker (Planned) |
Shubhayan Mukherjee |
Abstract Scope |
In advanced electronic packaging, high electric current density has an impact on material stability. Intermetallic compounds (IMCs) are formed at metal interfaces, playing a vital role in interconnect reliability. Cu6Sn5, a commonly observed IMC, exhibits the hexagonal ƞ phase above the transition temperature of 186 ℃ and the monoclinic ƞ' phase below it. However, our understanding of how electric current affects the phases, and their transition is limited. In this study, we focused on the low-temperature monoclinic phase (ƞ') of Cu6Sn5 to investigate how electric current influences its stability and properties. Pillar-shaped samples of the ƞ'-Cu6Sn5 compound were created, to perform in-situ nanoindentation. This allowed us to observe and study the mechanical and crystallographic changes that occur in the ƞ' phase in the presence of electric current. Understanding the impact of high electrical current density on Cu6Sn5 properties is crucial for advanced packaging development. |
Proceedings Inclusion? |
Planned: |
Keywords |
Other, Other, Other |