| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Investigations of Current-induced Grain Growth and Properties Variation in Pure Ag Metal Under Extremely High Current Density |
| Author(s) |
Su-Chen Liao, Hsuan-Cheng Huang, Po-Hsuan Yang, Chien-Lung Liang |
| On-Site Speaker (Planned) |
Su-Chen Liao |
| Abstract Scope |
Ag is regarded as a potential interconnection material due to its excellent electrical performance and oxidation resistance. In this study, the microstructure and properties variations of pure Ag metals under electric current stressing were investigated. The micro-hardness and electrical resistivity of as-rolled pure Ag metals decreased with an increasing current density due to the grain growth occurrence. Current stressing induced reductions in micro-hardness and electrical resistivity of up to 35.8% and 45.1% decrements, respectively, at an extremely high current density of 1.44 × 10^5 A/cm^2 for 1 h. The softening behavior accompanying the stress relaxation as well as the electrical resistivity reduction during current stressing were further discussed and explained based on the electron backscattered diffraction (EBSD) and X-ray diffraction (XRD) analyses. The thermal annealing benchmark was also conducted as a comparison to investigate the thermal and athermal contributions of current stressing. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Characterization |