| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Chlorination and Power Cycling Characteristics of Fine Au/Pd Coated Copper Wire
|
| Author(s) |
Che-Hao Chang, Fei-Yi Hung |
| On-Site Speaker (Planned) |
Che-Hao Chang |
| Abstract Scope |
In this research, gold and palladium layers are electroplated on the surface of copper wire to improve corrosion resistance and to enhance oxidation resistance. Chlorination test and power cycling test are conducted to discuss the difficulties in practical application and to reveal their deterioration mechanism. In chlorination test, both tensile strength and elongation decrease since chloride ions attack the surface of wires. However, if comparing Au/Pd-coated wires to those of pure copper, the coating layer still has a significant impact on the improvement of corrosion resistance. In power cycling test, voids appear on the interface of Pd layer and copper matrix. As the number of cycle increases, grain growth are induced by Joule’s heat, which is produced by high current density. Besides, repeated thermal expansion effect results in fatigue which makes the whole system fail. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |