| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
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| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
Microstructures, Mechanical and Thermal Property Evaluation of Binder Jet Printed High Conductivity Copper Parts. |
| Author(s) |
John Samuel Dilip Jangam, Thomas Anthony, Jake Piderman, Michelle Niu, Elizabeth Galati, Lihua Zhao |
| On-Site Speaker (Planned) |
John Samuel Dilip Jangam |
| Abstract Scope |
Binder jet additive manufacturing technology involves binding metal powder particles together to produce a green part. In this work, HC Cu copper powder from Sandvik Osprey was used to 3D print green parts using proprietary organic and inorganic binders. Green parts possessed good green strength, typically around 4 to 8 MPa, after curing at 90°C or 120°C. Green parts were subjected to debind and sintering treatment to improve density and properties. Debound parts and parts sintered at different temperatures were subjected to microstructural examination to determine the effects of the binder on sintering. Fully sintered parts were subjected to HIP to achieve high density (~98%). Mechanical and thermal properties were evaluated in as-sintered and HIP conditions. Binder jet printed copper parts after HIP showed yield strength up to 80MPa, ultimate tensile strength 210MPa, elongation 55%, and thermal conductivity, typically 365W/m-K. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |