| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Characterization Techniques for Quantifying and Modeling Deformation
|
| Presentation Title |
L-1: Elastic Mismatch and Mixed-mode Buckling-induced Delamination: Influence on Mode I Adhesion Measurements |
| Author(s) |
Stanislav Zak, Megan J. Cordill |
| On-Site Speaker (Planned) |
Stanislav Zak |
| Abstract Scope |
Recent progress in modern industry leads to miniaturization and use of thin films and coatings e.g. in microelectronics devices for conductive layers or in harsh environment protective coatings. Such applications combine largely dissimilar materials, which can lead to critical failure at the interface by delamination fracture. Therefore, the investigation of modern thin films adhesion on different substrates is crucial. A straightforward method to measure the adhesion is the buckling induced delamination method by Hutchinson and Suo, assessing the mixed-mode adhesion energy. With a proper assessment of the mixed-mode conditions at the delamination crack tip, the true mode I adhesion GIc of the thin film can be evaluated. The presented work is aimed at quantification of the influence of elastic mismatch on the calculation of GIc for real material combinations and comparison of buckling delamination with/without elastic mismatch influence in regards to pure mode I experimental measurements of thin film adhesion. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Modeling and Simulation, Mechanical Properties |