| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
The Effect of Surface Roughness on Spreading of SAC305 on Ag Substrates |
| Author(s) |
Wunmi Olukoya, Russell Goodall |
| On-Site Speaker (Planned) |
Wunmi Olukoya |
| Abstract Scope |
The relationship between surface roughness and solder spreading is a crucial factor in enhancing the wettability of solder systems. Previous research has found that as surface roughness increases, solder spreads more easily on metallic substrates. However, the effects of surface roughness on the various mechanisms that govern the solder/substrate interface, such as the growth of intermetallic compounds, are still not fully understood. Lead-free solder, SAC305, commonly used in joining electronic components, was used in the study. A range of roughness’ were produced on Ag substrates, with spreading measured using via in-situ observations of the lead-free solder. Although a pattern of increased spreading with increase roughness was observed in using both 2D and 3D roughness metrics, the significance of the relationship was varied. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Joining, Electronic Materials |