| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Effect of Microstructure of Ag on the Growth of Intermetallic Compound in Ag-In System During Isothermal Reflow Process |
| Author(s) |
Po-Hsun Yang, Fan-Yi OuYang |
| On-Site Speaker (Planned) |
Po-Hsun Yang |
| Abstract Scope |
The internet of Things (IOT) has been developed over the past decade. However, most sensors in IOT system have a low heat tolerance. Therefore, indium-based solders, which have a lower melting temperature, are considered the substitute for traditional tin-based solder during the solid-liquid interdiffusion bonding (SLID) process. This study investigates the growth behavior of intermetallic compounds (IMCs) during SLID process regarding different microstructures of Ag under bump metallization (UBM). The results show that the Ag under bump metallization with nanotwinned structure shows the lowest growth rate of IMC. In addition, the surface morphology of Ag-In IMCs was examined. The corresponding growth kinetic of IMCs regarding different Ag microstructures will be discussed in detail. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Thin Films and Interfaces |