| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
On the Adhesion of a Sintered Ag Joint on a Cu Substrate using Laser Shocks Influence of Aging |
| Author(s) |
Anna Gordun Peiro, Thibaut De Resseguier, Loic Signor, Eloic Ferdinand, Jacques Baillargeat, Hadi Bahsoun, Xavier Milhet |
| On-Site Speaker (Planned) |
Xavier Milhet |
| Abstract Scope |
Ag paste sintering, is a promising candidate for die bonding in the next generation of power electronic modules. In order to model the behavior of the system, there is a need for a fine characterization of the joint itself as well as those of the interface, especially during aging. In this study, we have explored an alternative route to test the adhesion of the Ag film on a Cu substrate using laser driven shocks: a laser pulse is calibrated to induce a tensile stress at the interface between the substrate and the film, and time-resolved velocity measurements complemented by post-recovery observations provide quantitative information on the adhesive strength. This method presents the advantage over other techniques to really focus on the interface properties. The results are used to explore the relationship between adhesion, aging and the underlying microstructure. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |