| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Characterization Techniques for Quantifying and Modeling Deformation
|
| Presentation Title |
Revealing the Role of Microstructure Architecture on Strength and Ductility of Ni Microwires by In-situ Synchrotron X-ray Diffraction |
| Author(s) |
Ludovic Thilly, Ravi Purushottam, Céline Gerard, Loic Signor, Atul H. Chokshi |
| On-Site Speaker (Planned) |
Céline Gerard |
| Abstract Scope |
Deformation mechanisms of cold drawn and electropolished nickel microwires are studied by performing in-situ tensile tests under synchrotron radiation. In-situ X-Ray diffraction allows understanding the mechanical response of the different grain families. The measurements were carried out on several microwires with diameters ranging from as-drawn 100 µm down to 40 µm thinned down by electropolishing. The as-drawn wires exhibit a core-shell microstructure with <111> fiber texture dominant in core and heterogeneous dual fiber texture <111> and <100> in shell. Reduction of specimen size by electropolishing results in a higher yield stress and reduced ductility. In-situ XRD analysis reveals that these differences are linked to the global variation in microstructure induced by shell removal with electropolishing, which in turn affects the load sharing between grain families. This study thus proposes a new way to increase ductility and strength in nickel microwires by tuning the microstructure architecture. [Scientific Reports, 9 (2019), 79] |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |