| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Solid-State Diffusion Bonding of Metals and Alloys
|
| Presentation Title |
Diffusion bonding of nickel-based alloy 617 and 316H stainless steel |
| Author(s) |
Mohamed S. Elbakhshwan, Lukas Desorcy, Ian Jentz, Mark Anderson |
| On-Site Speaker (Planned) |
Mohamed S. Elbakhshwan |
| Abstract Scope |
Solid state diffusion bonding has been used to create CHXs for various applications. The bonding process starts with heating the samples to high temperature for a certain amount of time to allow atomic diffusion, while applying pressure to close any gaps or asperities between the mating surfaces. The process leaves no internal stress or heat affected zones and may be applied to a large number of sheets.
Extensive knowledge exists for successful diffusion bonding of several materials, achieving properties equivalent to that of the wrought metal at both room and elevated temperatures. However, most alloys are limited for high temperature applications. This study focuses on the optimal bonding conditions for nickel-based alloy 617 and 316H stainless steel (SS316H) with emphasis on mechanical performance in high temperatures. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
High-Temperature Materials, Joining, Mechanical Properties |