| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Characterization of Minerals, Metals and Materials
|
| Presentation Title |
K-119: Solder Cup Wire Insertion Study |
| Author(s) |
Shelley Williams, Lisa A Deibler, Rebecca Wheeling |
| On-Site Speaker (Planned) |
Shelley Williams |
| Abstract Scope |
Should 100% wire insertion remain a requirement for soldering during cable fabrication?
Three conditions are required by the Association Connecting Electronic Industries for an acceptable solder cup connection (IPC-A-610): Wire leads must contact back wall of cup, be inserted for the full depth of cup, and visible solder must vertically fill at least 75% of the visible cup.
Recent use of X-ray micro computed tomography (CT) scans have revealed that solder cups can appear to be 100% filled and wires fully inserted but contain significant voiding at the bottoms of cups. To establish a technical basis for continuing the 100% insertion requirement and ascertain how best to measure it, solder joints from connectors were examined via CT and joints were pull tested to correlate wire insertion, solder fill, and joint angle with joint strength. |
| Proceedings Inclusion? |
Planned: |