| About this Abstract |
| Meeting |
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
| Symposium
|
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
| Presentation Title |
Physics-Based Simulation of Bondline Thickness Evolution During the Cure Process |
| Author(s) |
Alireza Forghani, Steven Roy, Paulo Silva, Malcolm Lane, Yusei Kondo, Koichi Hasegawa, Ryoji Okabe, Drazen Djokic, Yunfa Zhang, Ali Yousefpour, Goran Fernlund, Anoush Poursartip |
| On-Site Speaker (Planned) |
Alireza Forghani |
| Abstract Scope |
The adhesive thickness plays a key role in the mechanical response of the bondline in a secondary-bonded structure. For example, the fracture toughness of the adhesive layer is strongly dependent on the bondline thickness. In this study, a physics-based simulation using the COMPRO finite element platform is used to model the evolution of the bondline thickness during the manufacturing process. Adhesive flow, effect of adherend surface features, and deformation of the adherends during the autoclave bonding process are all incorporated in the simulation. Model predictions are validated against experimental measurements performed at the coupon level, sub-component, and component scales. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |