| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
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| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
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| Presentation Title |
Growth of Cu6Sn5 in a Cu/Sn/Cu Micro-Joint with a TFMG/Cu Dual Diffusion Barrier Layer During Thermocompression Bonding |
| Author(s) |
Ren-Jie Wu, Chi-Hang Lin, YU-QIAN ZHANG, Ya-Han Ye, Zhu-Yuan Zhao, Kai-An Yang, Ming-Tzer Lin |
| On-Site Speaker (Planned) |
Ren-Jie Wu |
| Abstract Scope |
In this work, we investigate the growth of intermetallic compounds (Cu6Sn5) in a Cu/Sn/Cu micro-joint with a TFMG/Cu dual diffusion barrier layer during thermocompression process. We deposited a thin film of metallic glass (Zr69Cu24Ti7) and a Cu film stacked together and used them as the dual diffusion barrier layer in a Cu/Sn/Cu micro-joint structure. For the dual diffusion barrier layer, the thin Cu film reacted with the Sn to form Cu6Sn5 IMCs, and the Zr69Cu24Ti7 TFMG suppressed Cu3Sn IMCs and Kirkendall voids formation. These results provide a promising route to improve thermal stability and performance much better than the single barrier samples. The significance of this work lies in understanding the employment of a bi-layer of TFMG/Cu as a diffusion barrier in a Cu/Sn/Cu micro-joint for three-dimensional interconnects. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Thin Films and Interfaces, Joining |