| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
Process Modeling for Fluid-Interface Supported Resin Printing |
| Author(s) |
Siva Appana, Stacy Ross, Christian Sims, Amit Jariwala |
| On-Site Speaker (Planned) |
Siva Appana |
| Abstract Scope |
The article discusses a new technique for conducting top-down Stereolithography (SLA) 3D printing, which reduces or eliminates the need for solid support. The technique involves printing from a thin resin layer above a static immiscible supporting fluid that prevents deflection from buoyant and gravitational forces on thin overhangs from anchored parts due to minute density differences between the supporting fluid and cured resin. The complex curing and shrinkage dynamics are a primary knowledge gap. Experimental validations reveal that curing the first overhang layer with minimal distortion and curl poses a significant challenge. The article details the latest design and implementation of the FISP prototype to enable reliable curing and presents a Multiphysics model simulated on COMSOL to characterize and model the curing process, including the effects of chemical shrinkage on the overall deformation in the part and the decay of light intensity through a volumetric intensity light model. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |