About this Abstract |
Meeting |
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
Symposium
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6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
Presentation Title |
Investigation of Liquid-Assisted Void Healing in Solders |
Author(s) |
Georg Siroky, Elke Kraker, Dietmar Kieslinger, Ernst Kozeschnik, Werner Ecker |
On-Site Speaker (Planned) |
Georg Siroky |
Abstract Scope |
This work discusses a framework for modelling liquid-assisted healing in low melting solder alloys. Damage evolves due to inelastic deformation in a unified creep-plasticity framework. The total void volume arises from nucleation and growth of single voids. Nucleation depends on the stress triaxiality and initial nucleation sites. The void growth equation includes a creep and plastic growth term to account for a general unified model. The size dependency of void healing is modelled by means of a void collective, which introduces the void size distribution. The size evolution of a void in a locally liquid medium is given by the Rayleigh-Plesset equation. The healing model combines physically motivated variables, such as liquid viscosity, surface tension, liquid- and void pressure. Furthermore, microstructural parameters, such as e.g. permeability or liquid film thickness, obtained from X-ray tomography images are also included. The sensitivity of healing with respect to model parameters is discussed. |
Proceedings Inclusion? |
Definite: Other |