| About this Abstract |
| Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Symposium
|
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Presentation Title |
Soldering and Electroplating to AM Surfaces |
| Author(s) |
Benjmain White, Joseph Erwin, Tylan Watkins |
| On-Site Speaker (Planned) |
Benjmain White |
| Abstract Scope |
The advantages of AM are now clearly accessible to designers at the part level, however these compelling advantages are often lost when considering the system design as a whole, as additional post processing, particularly joining of AM parts becomes a new challenge. Heat exchangers and electrical components such as cables require excellent thermal, electrical, and even hermetic connections to the system. We will present data on soldering and electroplating to AM surfaces produced by BPE, powder DED, and LPBF processes. AM copper is presented as the primary material focus because its widespread use in both electrical and thermal applications that require a metallurgical joint. Electroplating parameters for AM 17-4 PH are also identified, and found to produce full coverage, solderable platings. The complex surface topography of AM surfaces produces an inhomogeneous wetting by molten solder, however even minor surface polishing was found to improve joint strength significantly. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |