| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Low-temperature Direct Bonding of Co-sputtered Cu-Ag Alloy Thin Films |
| Author(s) |
Yu-Chieh Wang, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Yu-Chieh Wang |
| Abstract Scope |
The size of components has been shrinking recently to increase the density of transistors to improve the performance of electronic products. With the trend of miniaturization, the size of solder joints shrinks, and the volume ratio of intermetallic compounds (IMC) in solder joints gradually increases. Due to the brittle nature and poor conductivity of IMC, the reliability and conductivity problems will limit the use of solder. Thus, metal-to-metal direct bonding is considered one of the promising methods to replace solder joint technology. This study successfully developed a low-temperature bonding process at 200℃under 1.6x10^(-1) torr environment by using Cu-Ag thin films. The Cu-Ag thin films were fabricated by co-sputtering technique, and different contents of Ag were doped into Cu thin films to achieve higher mechanical strength. The effect of doping concentration of Ag, bonding parameters, and bonding quality will be discussed in detail in this talk. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Thin Films and Interfaces, Other |