| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
Effects of Storage Time on the Growth of Cu(In,Sn)2 |
| Author(s) |
Kai-Chia Chang, G. W. Wu, Yi-Wun Wang |
| On-Site Speaker (Planned) |
Kai-Chia Chang |
| Abstract Scope |
Nowadays, indium is a popular material in electronic packaging for low-temperature solder. The advantages of indium include low melting point and good mechanical properties. In this study, the interfacial reactions were conducted by using Sn52In and Cu during different reflow time and room temperature storage. The purposes of this study is to analyze microstructure and mechanical properties. When the storage time is below 20 h, Cu6(Sn,In)5 formed at the interface. Cu(In,Sn)2 formed between solder and Cu6(Sn,In)5 as the storage time increase. The fast reactions between In and Cu cause the Cu(In,Sn)2 formation at room temperature. Eventually, the Cu6(Sn,In)5 transferred slowly to Cu(In,Sn)2. It is outmost importance to notice the storage time of Sn52In solder at room temperature for low-temperature applications. |
| Proceedings Inclusion? |
Planned: |