| About this Abstract |
| Meeting |
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
| Symposium
|
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
| Presentation Title |
High-Fidelity Modeling of Bondline Failure in Polymeric Matrix Composites Considering the Effects of Manufacturing Defects |
| Author(s) |
Guillaume Seon, Yuri Nikishkov, Andrew Makeev |
| On-Site Speaker (Planned) |
Guillaume Seon |
| Abstract Scope |
Adhesively bonded Polymeric Matrix Composite (PMC) structures promise cost savings and increased production rates in future composite airframes, yet their susceptibility to defects and complex failure mechanisms hinder their widespread adoption. High-fidelity computational analysis methods that can capture the effect of defects and improve the understanding of failure mechanisms that govern bondline failure are needed to support qualification and certification of next-generation bonded PMCs. In this work, a continuous-discontinuous approach is considered for capturing quasi-brittle cohesive failure within epoxy adhesives and predicting crack growth in presence of bondline defects. In this methodology, the bondline is discretized using a solid layer of continuum elements. A plasticity-based continuum damage mechanics (CDM) model with localizing-gradient damage regularization is employed to capture the diffuse formation of a process zone during the early stages of cohesive failure. Upon reaching a diffuse damage threshold, extended finite element method (XFEM) crack enrichments are introduced to account for the strong discontinuities associated with the final stages of damage localization leading to adhesive fracture. Material inputs for the elasto-plastic constitutive model are obtained from tensile tests on dogbone specimens fabricated from plaques of the neat adhesive material. Adhesively-bonded double-cantilever beam (DCB) test specimens with seeded initial disbond defects are considered for verification of the approach. FE models are generated based on X-Ray CT data to account for the as-manufactured geometry, including variation in bondline thickness and location of seeded defects. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |