| About this Abstract |
| Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Symposium
|
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Presentation Title |
Molten Metal Jetting of Copper and Silver Electronic Traces |
| Author(s) |
Usama Rifat, Paarth Mehta, Denis Cormier |
| On-Site Speaker (Planned) |
Denis Cormier |
| Abstract Scope |
The additive manufacturing of printed electronic circuit patterns is typically done using conductive nanoparticle inks with Direct-Write (DW) printing processes. Although DW processes offer considerable flexibility for printing multiple materials and fine features, relatively low electrical conductivity and poor substrate adhesion are noted drawbacks of these processes. This talk will present recent advances in the use of molten metal droplet jetting (MMJ) to print solid copper and silver electronic traces that are functionally equivalent to solid core metal wires. MMJ eliminates drying and curing of nanoparticle inks, and the solidified metal's electrical conductivity matches that of the bulk material under optimized jetting conditions. Furthermore, the large cross-sectional area of the printed wires makes the traces well suited for power electronics applications involving high current. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |