About this Abstract |
Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
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Symposium
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2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
Presentation Title |
Towards Sustainable Fabrication of Electronics via Molten Metal Jetting |
Author(s) |
Negar Gilani, Nesma Aboulkhair, Marco Simonelli, Mark East, Richard Hague |
On-Site Speaker (Planned) |
Negar Gilani |
Abstract Scope |
Drop-on-demand Molten Metal Jetting (DoD-MMJ) is gaining growing attention for its flexibility and versatility in additively fabricating sustainable microelectronic components. However, the use of this method with high-melting-point copper has been scarce due to processing challenges. In this study, an in-house DoD-MMJ platform, MetalJet, was used to explore the generation and deposition behaviour of Cu microdroplets onto ceramic and metallic substrates. Concurrently, droplet dynamics, solidification kinetics, microstructural evolution, and interface formation were investigated using a combined computational and experimental approach. Our findings underscore the critical role of controlling oxygen content to mitigate nozzle-level reactions during droplet formation. Despite the inherent poor wettability, Cu droplets exhibit adhesion to alumina surfaces facilitated by an interlocking mechanism. Notably, MetalJet-printed pillars demonstrated electrical resistivity as low as 6.75 ×10^(-8) Ωm. These outcomes mark a substantial advancement in the direct printing of functional components, signalling promising avenues for future research and industrial applications. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |