| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Real Time Imaging
|
| Presentation Title |
Multimodal Characterization of Sn-Bi Alloy Solidification using Synchrotron X-ray Microtomography and Energy Dispersive Diffraction |
| Author(s) |
Amey Luktuke, John Wu, Alan Kastengren, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Nikhilesh Chawla |
| Abstract Scope |
Sn-Bi alloys have garnered considerable interest due to their potential applications in advanced electronic packaging strategies. The formation of primary phases such as faceted Bi particles and Sn dendrites during solidification of solder alloys plays pivotal role in determining the mechanical and electrical behavior of a solder joint. It is important to understand the complex relationship between the evolution of microstructure and composition during solidification. In this study, for the first time, we have studied the Sn-70Bi alloy solidification using simultaneous 4D X-ray Tomography (XRT) and Energy Dispersive Diffraction (EDD) at beamline 7-BM of the Advanced Photon Source (APS). The microtomography analysis revealed the morphological changes and growth kinetics, while the EDD investigation provided the information regarding phase composition and lattice strain. In particular, we will report on the formation of Bi pyramid structures during solidification. The combined analysis provided unique quantitative correlations between these techniques which will be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Solidification, Electronic Materials |