| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Reliability of Silver─tin Alloy Sintering for Power Electronic Applications |
| Author(s) |
Wei-Chen Huang, Chin-Hao Tsai, C. R. Kao |
| On-Site Speaker (Planned) |
Wei-Chen Huang |
| Abstract Scope |
The growing demands for higher operating temperatures of high-power electronics gradually increase recently. In this study, ball-milled Ag alloy pastes containing different amounts of Sn are developed. Phase identifications and morphologies of the alloyed powders are carried out by XRD and SEM, respectively. The structural integrity of the Ag–Sn alloy joint between Ag-metalized Cu substrates is investigated by thermal aging tests. Increasing Sn of Ag–Sn alloy paste to greater extent resulted in excellent wettability, low porosity, and even high bonding strength after 2000 h of aging at 300 ⁰C without Cu oxidation. Therefore, it is concluded that Ag–Sn alloy paste was a promising die-attach material with long-term high-temperature reliability. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, High-Temperature Materials, Powder Materials |