| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
|
| Presentation Title |
Enhance electrical conductivity and machinal properties of Cu-Cr alloys through Rapid Directional Solidification |
| Author(s) |
Arthur Zhang, Tao Sun, Ji Ma |
| On-Site Speaker (Planned) |
Arthur Zhang |
| Abstract Scope |
Copper alloys typically face a trade-off between mechanical properties and electrical conductivity, posing challenges for applications such as heat exchange systems or EV cooling systems for a combination of high conductivity and strength. Alloy addition in the solid solution that increases strength also reduces electrical conductivity due to solute scattering. In order to break the trade-off, we propose the rapid directional solidification (RDS) process during laser powder bed fusion (LPBF) to utilize micro-segregation and create a cellular/dendritic structure where solute migrates to the inter-dendritic and thus increase the purity of the solid solution concentration of the matrix, therefore leading to higher conductivity.
To further magnify the micro-segregation effect, we propose incorporating ternary elements, such as Zr. Using CALPHAD simulation, the addition of Zr is hypothesized to enhance micro-segregation, as indicated by its decreased solubility in the ternary Cu-Cr-Zr. CALPHAD predictions are validated through experimental composition measurements of EDS and TEM. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Solidification, Copper / Nickel / Cobalt |