| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Transparent Bonding of Flexible Substrates Without an Absorber by Using Laser Heating |
| Author(s) |
Eunhye Lee, Jeehoo Na, Sang-Eun Han, Taeyoon Im, So Jeong Lee, Byeong-Kwon Ju, Tae-Ik Lee |
| On-Site Speaker (Planned) |
Eunhye Lee |
| Abstract Scope |
Recent commercialization of flexible display products aims for advanced displays which are transparent in the whole display packages. In order to achieve this, transparent joints are needed, as well as flexibility and ensuring the robustness of the joint against mechanical deformation. In this study, an absorber-free laser bonding method for transparent joints was developed that is robust and flexible. A spread laser with the wavelength of 1065 nm was used to induce bonding between polymeric substrates, and the mechanism of bonding was elucidated. Bonding the substrates directly without a bonding medium simplified the process and eliminated any voids at the bonding interface. The bonding conditions were optimized through control of laser pressure, time, and power. The mechanical reliability of the joint was evaluated through tensile and flexural tests, and the bonding interface was examined using scanning electron microscopy. Additionally, transmittance was measured to evaluate optical properties of the bonded joint. |
| Proceedings Inclusion? |
Planned: |