| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Formation of Cu-Cu Direct Bonding by Green Synthesized Approaches |
| Author(s) |
Wei Liu, Kuo-Shuo Huang, Wen-Chih Lin, Jim Wang, Albert T. Wu |
| On-Site Speaker (Planned) |
Wei Liu |
| Abstract Scope |
Cu to Cu direct bonding is considered as a new packaging technique for power device module. The Cu particles with different sizes are chemically synthesized in organic acidic solution. The Cu particles aggregate in the solution and form Cu paste. Cu particles are sintered at temperatures below 150 oC for different duration of times in ambient. The Cu particles in the paste are prevented from oxidation. Sintering of the Cu particles occurs continuously. Cu paste is applied between two Cu coupons, and the morphology of the sintered bonds are examined by optical and scanning electron microscopy. The Cu paste is also applied between Cu wires for measuring resistivity. Detail bonding mechanism is investigated by using transmission electron microscope. The effect of particle sizes on bonding ability is assessed. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |