| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Effects of Sb Addition on the Mechanical Behavior of Eutectic Sn-Bi Solder Alloys |
| Author(s) |
Hannah Fowler, Sukshitha Achar Puttur Lakshminarayana, Sean Lai, David F Bahr, Ganesh Subbarayan, John E Blendell, Carol A Handwerker |
| On-Site Speaker (Planned) |
Hannah Fowler |
| Abstract Scope |
Eutectic Sn-Bi solders, that are reflowed at 180°C, limit the heating-induced warpage in chip assemblies reducing head in pillow defects. Thus, Sn-Bi solders are used in place of Sn-Ag-Cu (SAC) solder alloys reflowed at 240°C. However, eutectic Sn-Bi solders are highly strain-rate dependent. Sn-Bi performs well at low strain-rates during thermal cycling but performs poorly during the high strain-rates in drop-shock reliability testing. Small alloying additions of Sb and Ag can improve drop-shock reliability by increasing the ductility of Sn-Bi alloys and by increasing joint strength. In this work, we will show how different amounts of Sb additions impact the mechanical properties of eutectic Sn-Bi and eutectic Sn-Bi-1Ag solder alloys on Cu substrates through nanoindentation and shear testing of solder joints. We found that as little as 0.5 wt% Sb addition to eutectic Sn-Bi solder was sufficient to improve the mechanical behavior of the solder joint. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Mechanical Properties |