| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Towards Practical Demountable Joints for Fusion Devices - Microstructure Formation and its Stability in the In-Bi-Sn Ultra-low-temperature Eutectic Soldering Alloy |
| Author(s) |
Sergey A. Belyakov, Greg Brittles |
| On-Site Speaker (Planned) |
Sergey A. Belyakov |
| Abstract Scope |
Tokamak Energy are developing high temperature superconducting magnets for application in fusion energy devices, as well as other emergent applications. Joints are key components in HTS magnets, forming electrical, thermal and mechanical connections between discrete coils and sub-assemblies. These must be practical, reliable, have sufficient electrical, thermal and mechanical properties to perform as-required under high magnetic field and cryogenic conditions. Due to the significant challenges posed by tokamak assembly and maintenance, soldering at ultra-low process temperatures is considered, below even those used typically in Sn-Bi or Sn-In solder reflow. In-based compositions are potential candidates for the next generation of low-temperature solder materials. In this talk we explore the microstructure formation in In-Bi-Sn solders and investigate their microstructural stability as well as the impact this has on joint mechanical and electrical properties. The results provide new insights and a foundational understanding of the long-term reliability of In-based ultra-low-melting point solder joints. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Characterization |