| About this Abstract |
| Meeting |
TMS Specialty Congress 2025
|
| Symposium
|
The 7th International Congress on 3D Materials Science (3DMS 2025)
|
| Presentation Title |
Atomistic Simulations to Reveal HIP-Bonding Mechanisms of Al6061/Al6061 |
| Author(s) |
Ankit Roy, Vineet Joshi, Rajib Kalsar, Miao Song, Ayoub Soulami |
| On-Site Speaker (Planned) |
Ankit Roy |
| Abstract Scope |
Molecular dynamics simulations were employed to understand the diffusion bonding process during hot isostatic pressing (HIP) of Al6061/Al6061 alloy. Simulations of the HIP process reveal atomistic phenomena that are difficult or unlikely to be observed experimentally and provide useful insights into the mechanism of diffusion and bonding. The results reveal that at the start of the HIP process, a massive incursion of oxygen atoms occurs from the pre-existing γ-Al2O3 to the 6061 region across the interphase interface. These oxygen atoms interact with the enriched Mg atom layer present at the existing γ-Al2O3 and 6061 matrix to form a secondary complex Mg2Al2O5 phase. Diffusion calculations also show that transport of atoms due to the applied pressure is 4–5 orders of magnitude higher than would occur in the absence of HIP conditions. The Mg2Al2O5 phase also provides efficient pathways for the rapid transport of Mg atoms. |
| Proceedings Inclusion? |
Undecided |