About this Abstract |
Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
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Symposium
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2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
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Presentation Title |
Characterization of 3D Printed and Wire Embedded Thermoplastic Composite Structures |
Author(s) |
Kazi Md Masum Billah, Jeffrey Gleasman, Bryan Quezada, Neel Rathod, Mario Barron Gonzalez, Adam Kennedy |
On-Site Speaker (Planned) |
Kazi Md Masum Billah |
Abstract Scope |
This research evaluates and characterizes the thermal and physical characteristics of thermoplastic specimens embedded with conductive wire using a Fused Filament Fabrication 3D printer. The specimens were manufactured through a novel approach “Pause and Go” in additive manufacturing for embedding conductive wires into a 3D printed thermoplastic substrate using a custom-built wire embedding tool integrated into a commercially available desktop Independent Dual Extruder (IDEX) printer. Wire-embedded test specimens were produced via 3D printing using Polylactic Acid and Acrylonitrile Butadiene Styrene. The 26-gauge nichrome wire was embedded in the top substrate and continued the printing to fully embed the wires. Thermal testing was carried out and observed steady-state temperatures after 30 minutes. Fracture toughness testing was conducted using 3-point flexural tests and showed a significant improvement. The wire pull tests characterized the bonding strength of the wire and substrate. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |