| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior at the Nanoscale V
|
| Presentation Title |
Effect of Layer Spacing on Mechanical Properties of Cu/Co Nanolaminates Through Tensile Testing |
| Author(s) |
Rohit Berlia, Paul Rasmussen, Santhosh Kiran Rajarajan, Jagannathan Rajagopalan |
| On-Site Speaker (Planned) |
Rohit Berlia |
| Abstract Scope |
The deformation behavior of nanostructured metallic multilayers has been extensively investigated because of their superior mechanical properties, primarily via nanoindentation and micropillar compression experiments. Here, we report tensile measurements on Cu/Co nanolaminates with four different layer spacings (2nm, 4nm, 8nm, 16nm), but similar film thickness. The nanolaminate was synthesized using magnetron sputtering at room temperature and tensile loading-unloading cycles were performed on freestanding samples parallel to the Cu/Co interface using MEMS devices. Cross-sectional TEM and XRD measurements showed the transition from the presence of coherency at the Cu/Co interface in smaller spacing to loss of coherency in higher spacing films. The yield strength of nanolaminates is inversely dependent on the square root of layer thickness. Furthermore, an inelastic strain recovery was also observed in all the films both during and after unloading, with further recovery occurring upon heating. Negligible effect of layer spacing was observed on elastic modulus. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |