| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Corrosion Induced Fracture of Cu/Al Interconnects in Microelectronics Packages |
| Author(s) |
Kai-chieh Chiang, Marisol Koslowski |
| On-Site Speaker (Planned) |
Kai-chieh Chiang |
| Abstract Scope |
Cu wire bonding is susceptibility to corrosion and its lifetime is shorter than its gold (Au) counterpart. To enhance the use of Cu wires in microelectronic packages, numerical simulations are utilized to understand the failure mechanisms better. Corrosion occurs in intermetallic compound (IMC) Cu9Al4, which turns into Al2O3 with Cu precipitation. This leads to volumetric expansion and induced stresses around the IMC and Cu interface. Here we present phase field simulations of both the evolution of the corrosion and the crack. The simulations are performed under the uHAST (unbiased highly accelerated stress test) environment. A Phase Field model is used to track the corrosion interface evolution which involves the Cu-Al intermetallic. The solution of corrosion is transferred to the Phase Field fracture model to calculate the crack propagation caused by the volumetric expansion. The results of the simulations under uHAST environment are applied to develop time-to-failure models during usage. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Modeling and Simulation, Other |