| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XIII
|
| Presentation Title |
Development of Medium and High-Entropy Diffusion Barrier for GeTe-Based Thermoelectric Module |
| Author(s) |
Yi-Hsuan Lai, Yun-Han Huang Lu, Hsin-jay Wu |
| On-Site Speaker (Planned) |
Yi-Hsuan Lai |
| Abstract Scope |
The pursuit of efficient direct conversion of heat into electrical power has led to increased interest in thermoelectric materials. However, the operational challenges faced by thermoelectric modules in high-temperature conditions has highlighted the need for stable module joints. Our research is dedicated to identifying a highly effective thin film diffusion barrier for medium-temperature (600 K – 800 K) thermoelectric materials. We develop a thin-film diffusion barrier that can effectively inhibit inter-diffusion between copper electrodes, solder, and GeTe-based thermoelectric legs. This study involves the strategic deposition of medium to high-entropy alloy thin film barriers on the GeTe-based substrate, with the ultimate goal of enhancing the energy conversion efficiency and thermal stability after the multiple cycling measurements. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Energy Conversion and Storage, High-Entropy Alloys, Thin Films and Interfaces |