| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Ag-Nodule Mediated Bonding With Ag-Si Metastable Phase |
| Author(s) |
Koji S. Nakayama, Yicheng Zhang, Masahiko Nishijima, Koji Inoue, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma |
| On-Site Speaker (Planned) |
Koji S. Nakayama |
| Abstract Scope |
We demonstrate the Ag nodule-mediated bonding where the rapidly cooled Ag-Si ribbon is directly used as the bonding medium, indicating the possibility of using it as a high-temperature bonding material with low-temperature processes. The key to this process is the metastable phase of the supersaturated Ag solid solution and the formation of Ag nodules. We also found that the metastable phases include the Ag-Si compounds and the amorphous Si, both of which may not contribute to the bonding process. We will discuss the shear bond strength, which depends on the Ag-Si alloy compositions and the sintering temperatures. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Composites, Joining, Nanotechnology |