| Abstract Scope |
As semiconductor components become more complex, traditional inspection methods such as serial sectioning and scanning electron microscopy are no longer sufficient due to their destructive nature, time-consuming processes, and potential damage to the specimen surface. Non-destructive techniques such as optical imaging, radiography, and scanning acoustic microscopy (SAM) have been valuable for detecting defects in semiconductor packages. 3D X-ray Computed Tomography (XCT) is an ideal solution for non-destructively assessing defects in semiconductor packages. By capturing spatial and temporal changes, time-resolved tomography (4D XCT) can offer unique insights into package behavior under thermal fatigue. In this talk, we discuss experimental, 3D, non-destructive characterization of defect identification and evolution with thermal cycling in Sn-based solder alloys. The role of porosity, the location of the solder ball in the package, and damage evolution mechanisms will be described and discussed. |