| Abstract Scope |
3D electronics has intrigued much attention for various applications. Despite much progress, a general method to assemble a broad range of materials into 3D electronics remains limited. In this talk, we will report our recently developed freeform multimaterial assembly platform (FMAP) which integrates 3D printing (fused deposition modeling, direct ink writing) with the freeform laser induction (FLI). 3D printing performs the 3D structural material assembly, while the FLI induces the functional materials in predesigned positions of the 3D structures by synergistical, programmed actuation. This platform can process laser induced graphene (LIG), metals, and metal oxides as high-performance sensing or/and electrode materials on any designated 3D printed insulting polymer substrates. Therefore, 3D electronics including crossbar LED circuit, touchpad for human-machine interaction, multiple sensors, sensor-enveloped springs, electromagnets, force feedback manipulators as well as the 3D microfluidic reactors with embedded heating elements were fabricated to demonstrate the versatility and effectiveness of the technique. |