| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Influence of Minor Alloying Elements on the Properties of Sn-Bi Alloys |
| Author(s) |
Yu-Hsin Lin, Fu-Ling Chang, Pei-Kang Wu, Meng-Chi Chuang, C. Robert Kao |
| On-Site Speaker (Planned) |
Yu-Hsin Lin |
| Abstract Scope |
This study investigates the effects of adding In, Ag, Cu, Ni, Sb, Ti, and Zn to Sn-Bi alloys on melting point, microstructure, and wettability, utilizing both experimental methods and phase diagram calculations. Adding 2 wt% Zn yields the smallest mushy zone, with the formation of Cu5Zn8 at the interface preventing brittle Bi phase accumulation and enhancing solder joint reliability. Sb and Ti were observed to refine the grain structure in as-reflow samples. Their ability to maintain a fine microstructure after prolonged aging period was also discussed. All minor elements in this study slightly reduce the wettability of Sn-Bi alloy, with Zn addition showing the worst due to tendency to oxidize, necessitating improved reflow conditions. This comprehensive analysis provides valuable insights for industry application, highlighting the distinct impacts of various minor alloying elements on Sn-Bi alloy properties. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Characterization, Other |