| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Electrodeposited Gallium for Cu-to-Cu Interconnection |
| Author(s) |
Tzu-hsuan Huang, Jian-wei Huang, Zhih-feng Lin, Shih-kang Lin |
| On-Site Speaker (Planned) |
Tzu-hsuan Huang |
| Abstract Scope |
Transient Liquid Phase (TLP) bonding technology, derived in 1970s, connects high-melting-point nickel-based superalloy materials at low bonding temperature to reduce the process costs. Recently, this technology has gained attention in electronic packaging due to its potential to address the issue of wafer warpage caused by CTE mismatch in 3D IC packaging. Gallium, which has a low melting point (29.8°C) and wide solubility in copper, shows significant opportunity to form solid-solution joints without intermetallic compounds for low-temperature bonding. In this talk, we will present the electroplating process for gallium and the mechanism of transient liquid phase bonding for the Cu/Ni/Ga/Ni/Cu reaction couples based on the cross-section analyses. Gallium based TLP bonding process shows promising in next generation industrial applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Thin Films and Interfaces |