| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Electroless Plated Highly (111) Nanotwinned Cu-to-Cu Direct Bonding |
| Author(s) |
I-En Chen, P. S. Shih, Yung-Sheng Lin , Yun-Ching Hung, Chun-Wei Chiang, C. R. Kao |
| On-Site Speaker (Planned) |
I-En Chen |
| Abstract Scope |
As the size of the electronic devices scale down, the requirement of higher interconnection density increases. Cu-to-Cu direct bonding become one of the solutions. In addition, with excellent mechanical properties and superior electrical properties, nanotwinned copper (nt-Cu) has emerged as a promising material in the field of microelectronic packaging. Moreover, electroless plating provide a more straightforward method to fabricated nanotwinned copper, and the high ration of the (111) plane facilitates Cu-to-Cu bonding. In this study, the Cu-Cu joints after bonding were further investigated using scanning electron microscopy (SEM), electron back-scattered diffraction (EBSD) ,and focused ion beam (FIB). |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Thin Films and Interfaces |