| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
Bonding Strength of ENIG Joint Using Micro-sized Ag Particles with Submicron Ceramic Particles |
| Author(s) |
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa |
| On-Site Speaker (Planned) |
Hiroshi Nishikawa |
| Abstract Scope |
Wide bandgap (WBG) semiconductors are being developed as promising replacements for Si-based semiconductors because they have high power density, operation frequency, and break down voltage. To assemble these devices, the high-temperature bonding process is one of the key technologies. Recently, metallic nanoparticles such as Ag and Cu have been explored by virtue of their high melting temperatures and superior electrical and thermal conductivities. However, the nanoparticle paste contains various organic substances and residual organic materials can induce the formation of unexpectedly large voids in the joint layer. To avoid this problem, we have proposed a bonding process using chestnut-burr-like micro-sized Ag particles and the effect of submicron ceramic particle addition into the micro-sized Ag particle paste on joint strength was evaluated before and after high-temperature storage and temperature cycling. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, |