| About this Abstract |
| Meeting |
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Symposium
|
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Presentation Title |
Galling-free Micro-forging of Titanium Wire with High Reduction in Thickness by Beta-SiC Dies |
| Author(s) |
Tatsuhiko Aizawa, Koh-Ichi Ito, Tatsuya Fukuda |
| On-Site Speaker (Planned) |
Tatsuhiko Aizawa |
| Abstract Scope |
Pure titanium as well as beta-type titanium alloys are difficult to be shaped into parts and tools by the stamping and forging. In particular, this chemical galling prevented titanium and titanium alloys from net shaping for medical parts and fine tools. In the present study, beta-type SiC coated SiC punch and die was developed to demonstrate that upsetting with the reduction in thickness by 60 % becomes free from metallic titanium transfer to die and punch surfaces. A pure titanium wire with the diameter of 0.98 mm was prepared for upsetting experiments by the CNC (Computer Numerically Control) micro-forging system. The relationship between measured torque and stroke reveals that pure titanium circular wire plastically deformed to a triangular pin by 60 % in reduction. SEM-EDX proved that no metallic titanium transferred onto the die and punch surface. |
| Proceedings Inclusion? |
Definite: At-meeting proceedings |