| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
Insights into the grain boundary sliding behavior of a Ni bicrystal |
| Author(s) |
Subin Lee, Divya Sri Bandla, Christoph Kirchlechner |
| On-Site Speaker (Planned) |
Subin Lee |
| Abstract Scope |
Despite decades of research into grain boundary sliding, the fundamental mechanisms remain unclear, particularly lacking quantitative insights such as the stress required for grain boundary sliding and the effects of loading conditions or grain boundary characters. This study investigates grain boundary sliding behavior using in situ scanning electron microscope micropillar compression on a model system, a Ni bicrystal with a high-angle grain boundary (~20°). Compression tests were conducted on micropillars with 1 µm and 3 µm diameters. The grain boundary was inclined by approximately 35° to the compression axis and penetrated the entire micro pillar. Grain boundary sliding was observed at 573 K (~0.33 T<sub>m</sub>) under strain rates of 10<sup>-3</sup> and 10<sup>-2</sup> s<sup>-1</sup>. From the postmortem analysis it was found that grain boundary sliding contributes between 40% and 65% of the total strain. A comparison with polycrystalline Ni highlights significant discrepancies in grain boundary sliding behavior at the micro scale. |
| Proceedings Inclusion? |
Planned: |