About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Micro-mechanical Testing of Grain Boundary Sliding in a Tin Alloy |
| Author(s) |
Junnan Jiang, Richard Todd, Angus J. Wilkinson |
| On-Site Speaker (Planned) |
Angus J. Wilkinson |
| Abstract Scope |
Grain boundary sliding (GBS) is an important deformation mechanism that contributes to creep and superplastic forming. In tin-based lead-free solders GBS can make significant contributions to in service performance. We have used FIB to cut short micro-scale cantilevers across targeted grain boundaries and then used a nano-indenter to drive shear deformation on the grain boundary plane. This approach allows GBS to be uncoupled from accommodation mechanisms that complicate interpretation in polycrystals. Effects of displacement-rate, and grain boundary character on the shear stress required for GBS have been examined. Post-test observations in SEM confirm that deformation if localised on the grain boundary and reveal the morphology of the slid boundary. Deformation rates and shear stresses obtained from the micro-scale test are compared to results from bulk tests on fine grained polycrystals. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |