| About this Abstract |
| Meeting |
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
| Symposium
|
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
| Presentation Title |
Process Modeling of Cure in Epoxy Based Polymer Matrix Composites Using ICME |
| Author(s) |
Prathamesh Deshpande, Sagar Shah, Sagar Patil, Michael Olaya, Gregory Odegard, Marianna Maiaru |
| On-Site Speaker (Planned) |
Prathamesh Deshpande |
| Abstract Scope |
It is well-known that residual stresses are caused by resin shrinkage and differential thermal contraction between the matrix and reinforcement. Not only are these residual stresses difficult to experimentally measure, they are difficult to predict computationally. Predictive models of the laminate curing process require detailed knowledge of the resin thermo-mechanical properties as a function of conversion, which cannot be determined through traditional continuum-scale modeling methods. Therefore, an Integrated Computational Material Engineering (ICME) approach is used to predict the effect of the cure cycle on the design and manufacturing of a carbon/epoxy composite (DGEBA-polyoxypropylene diamine resin). Molecular Dynamics using the Interface Forcefield (IFF-R) is employed to predict the resin properties as a function of the crosslink density. The predicted properties are subsequently used in micro-scale models that account for random fiber distribution using the Finite Element Method (FEM). Results indicate successful implementation of the two-scale method for process modeling of thermosets. |
| Proceedings Inclusion? |
Definite: Other |